AgileCore – AI Prefabricated Modular Data Centers

Description

AgileCore AI Modular Data Center

Modern AI workloads require infrastructure capable of handling high power density, extreme heat loads, and rapid capacity expansion. AgileCore combines factory-prefabricated construction with advanced liquid cooling technologies to create a flexible infrastructure platform for AI and high-performance computing.

Designed for AI training, AI inference, HPC, enterprise computing, and edge deployments, AgileCore helps organizations deploy high-density computing infrastructure faster while maintaining efficient thermal management.

Why Choose AgileCore?

Optimized Energy Efficiency

AgileCore supports multiple liquid cooling technologies, including Direct-to-Chip, Immersion Cooling, and Rear-Door Heat Exchangers, providing efficient heat removal for high-performance processors.

Integrated free-cooling solutions can reduce dependence on mechanical cooling under suitable ambient conditions, helping organizations lower operating costs and improve overall data center efficiency.

High-Density Computing

Liquid cooling enables AgileCore to support high-density AI racks with cooling capacity of up to 100 kW per rack, making it suitable for demanding GPU and HPC workloads.

The cooling architecture can integrate with standard IT racks while reducing the need for traditional aisle-containment infrastructure, helping organizations make better use of available data center space.

Rapid Deployment

AgileCore is factory-built, pre-engineered, and pre-tested, reducing the amount of onsite installation and commissioning work required.

Its modular architecture allows infrastructure to be deployed quickly and expanded as computing requirements increase.

Flexible Cooling Solutions

Rack-Based Liquid Cooling

A compact solution for AI startups, pilot projects, enterprise deployments, and edge computing environments.

Rack-based liquid cooling provides efficient thermal management while maintaining a familiar rack-based infrastructure approach. It can support high-performance computing within standard rack footprints and offers a scalable path for expanding AI capacity.

Prefabricated Liquid Cooling

Designed for AI training clusters and high-density computing environments, AgileCore’s prefabricated liquid cooling solutions can incorporate Direct-to-Chip and Rear-Door Heat Exchanger technologies.

Factory integration helps simplify deployment while providing the thermal performance required for demanding AI workloads.

Prefabricated Immersion Cooling

For applications requiring extremely high power density, AgileCore supports single-phase and two-phase immersion cooling configurations.

IT equipment is immersed in a specialized heat-conducting liquid, allowing heat to be transferred efficiently away from high-performance computing hardware.

Containerized AI Data Centers

AgileCore containerized data centers provide a modular and rapidly deployable infrastructure solution for AI farms and AI factories.

The containerized architecture can be configured for different computing requirements and deployed across enterprise sites, edge locations, remote environments, and challenging climates.

Organizations can start with the capacity they need today and expand their infrastructure as AI workloads grow.

Full Liquid Cooling Solutions

SmoothAir – Rear-Door Heat Exchanger

The Rear-Door Heat Exchanger captures heat from server exhaust air and transfers it to a chilled-water loop. The heated coolant is then circulated to an external cooling system where the heat is rejected before the cooled liquid returns to the system.

ByteCool – Direct-to-Chip Cooling

Direct-to-Chip cooling uses a cold plate positioned directly on the processor to capture heat at its source. Coolant circulates through the cold plate and transfers the captured heat through a heat exchanger to the facility cooling system.

OceanCool – Immersion Cooling

Immersion cooling places IT equipment directly into a heat-conducting liquid. Heat is transferred from the equipment to the liquid and subsequently removed through a liquid-to-liquid heat exchanger and external cooling system.